1. Isingeniso

I-HDI imele i-High Density Interconnector. Ibhodi lesifunda elinobuningi bezintambo eziphakeme endaweni yunithi ngayinye ngokungafani nebhodi elejwayelekile libizwa nge-HDI PCB. Ama-PCB e-HDI anezikhala nemigqa emihle, ama-vias amancane nama-pads wokuthwebula nokuqina okuphezulu kwephedi yokuxhuma. Kuyasiza ekwenzeni ngcono ukusebenza kukagesi nokunciphisa isisindo nosayizi wemishini. I-HDI PCB iyindlela engcono yokubalwa kwezingqimba eziphezulu namabhodi abunjiwe abizayo.

Izinzuzo Eziyinhloko ze-HDI

Njengoba umthengi efuna ushintsho, nobuchwepheshe kufanele bube njalo. Ngokusebenzisa ubuchwepheshe be-HDI, abaklami manje sebenenketho yokubeka izingxenye eziningi ezinhlangothini zombili ze-PCB eluhlaza. Izindlela eziningi ngezinqubo, kufaka phakathi i-pad ne-blind nge-technology, vumela abaklami be-PCB real estate ukubeka izinto ezincane zisondelene kakhulu. Ukwehla kosayizi wezinto nokuphakama kuvumela i-O / O eningi kumajometri amancane. Lokhu kusho ukudluliswa okusheshayo kwezimpawu kanye nokwehla okukhulu ekulahlekelweni kwesiginali kanye nokubambezeleka kokuwela.

Ubuchwepheshe ku-HDI PCB

• I-Blind Via: Ukuthintana nesendlalelo sangaphandle esiphela kusendlalelo sangaphakathi
• Ukungcwatshwa nge-Vole: Ukudlula ngaphakathi emgodini ongaphakathi
• IMicrovia: Blind Via (coll. Nayo nge) enobubanzi ≤ 0.15mm
• I-SBU (I-Sequential Build-Up): Isendlalelo sokulandelana esilandelanayo esinokusebenza okungenani kokucindezela kabili kuma-PCB e-multilayer
• I-SSBU (Semi Sequential Build-Up): Ukucindezela izakhiwo ezihlolwayo kubuchwepheshe be-SBU

Nge-Pad

Ugqozi oluvela kubuchwepheshe bokuphakama komhlaba kusukela ngasekupheleni kweminyaka yama-1980 lucindezele imikhawulo ngama-BGA's, COB kanye neCSP abe ngamasentimitha amancane wesikwele. Inqubo ye-in in pad ivumela ukuthi ama-vias abekwe ngaphakathi komhlaba ophathekayo. I-via iyagcotshwa futhi igcwaliswe ngama-epoxy aqhubayo noma angaqhubeki bese ehlanganiswa futhi embozwe ngaphezulu, okwenza kungabonakali.

Kuzwakala kulula kepha kunesilinganiso sezinyathelo eziyisishiyagalombili ezingeziwe zokuqedela le nqubo eyingqayizivele. Imishini ekhethekile kanye nochwepheshe abaqeqeshiwe balandela inqubo eduze ukufeza okufihliwe okuphelele nge-.

Via Izinhlobo Zokugcwalisa

Kunezinhlobo eziningi ezahlukahlukene zokugcwaliswa kwento yokugcwalisa: i-epoxy engaqhubeki, i-epoxy eqhubayo, ukugcwaliswa kwethusi, ukugcwala kwesiliva nokufakwa kwe-electrochemical. Konke lokhu kuphumela ekugqitshweni komhlaba ongaphansi komhlaba ozoba abathengisi ngokuphelele njengemihlaba ejwayelekile. Ama-Vias nama-microvias ayabholwa, angaboni noma angcwatshwe, agcwaliswe bese egcotshwa bese efihlwa ngaphansi kwamazwe ama-SMT. Ukucubungula ama-vias alolu hlobo kudinga imishini ekhethekile futhi kudla isikhathi. Imijikelezo yokubhola eminingi nokulawulwa kokujula okulawulwayo kunezela ekusebenzeni kwesikhathi.

Laser Drill Ubuchwepheshe

Ukubhoboza ama-micro-vias amancane kunawo kuvumela ubuchwepheshe obengeziwe ebusweni bebhodi. Kusetshenziswa ugongolo olukhanyayo lwama-microns angama-20 (1 Mil) ububanzi, lolu gongolo olunamandla lungasika insimbi nengilazi kwakha okuncane ngomgodi. Imikhiqizo emisha ikhona njengeyunifomu yezinto zokwakha ingilazi eziphansi zokulahleka kwe-laminate kanye ne-dielectric engapheli. Lezi zinto zinokumelana nokushisa okuphezulu komhlangano wamahhala womthofu futhi zivumela izimbobo ezincane ukuthi zisetshenziswe.

I-Lamination & Izinto Ezenzelwe Amabhodi we-HDI

Ubuchwepheshe obuthuthukisiwe be-multilayer buvumela abaklami ukuthi bangeze ngokulandelana izendlalelo zezingqimba zokwenza i-PCB ehlukahlukene Ukusetshenziswa kwe-laser drill ukukhiqiza izimbobo ezingxenyeni zangaphakathi kuvumela ukucwebezwa, ukucatshangelwa kanye nokuchithwa ngaphambi kokucindezela. Le nqubo engeziwe yaziwa njengokulandelana kokwakha. Ukuqanjwa kwe-SBU kusebenzisa ama-vias agcwalisiwe avumela ukuphathwa okungcono kokushisa, ukuxhumana okunamandla nokukhulisa ukuthembeka kwebhodi.

I-resin camera yethuthuke ngokukhethekile ukuze isize ngekhwalithi emgodini empofu, izikhathi zokubhola ezinde nokuvumela ama-PCB amancane. I-RCC inephrofayili ye-ultra-low kanye ne-foil e-ultra-thin yethusi eboshelwe ngamaqhuqhuva we-minuscule ngaphezulu. Le nto ilashwa ngamakhemikhali futhi ithathelwe ubuchwepheshe obuncane futhi obuhle kakhulu nobuchwepheshe bokushiya isikhala.

Ukusetshenziswa kokumelana okomile ku-laminate kusasebenzisa indlela evuthayo yokufaka roll ukumelana nezinto eziyisisekelo. Le nqubo yobuchwepheshe obudala, manje kunconywa ukuthi ushise kuqala impahla kushisa oyifunayo ngaphambi kwenqubo yokuvikela ngokhuni yamabhodi wesifunda aphrintiwe e-HDI. Ukushiswa kokuqala kwempahla kuvumela ukusetshenziswa okungaguquguquki kokumelana okumile ebusweni be-laminate, kudonsa ukushisa okuncane kude nemigoqo eshisayo futhi kuvumela amazinga okushisa aphumayo azinzile womkhiqizo okhiqiziwe. Ukushisa okungaguquguquki kokungena nokuphuma kuholela ekubambeni komoya okuncane ngaphansi kwefilimu; lokhu kubalulekile ekwakhiweni kabusha kwemigqa emihle nezikhala.