FPC / Ngesandla Esiqinile-Flex (amakhono)
Ngesandla Esiqinile PCB (amakhono)
FPC / Ngesandla Esiqinile-Flex (amakhono)
| Isendlalelo | Izingqimba 1-28 |  |
| Uhlobo lwamaLaminates | FR-4 (High Tg, Halogen Mahhala, High Frequency) I-PTFE, BT, Getek, Isisekelo se-Aluminium, Isisekelo seCopper, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
|
| Ukujiya kwebhodi | 6-240mil | |
| Isisindo sethusi iMax Base | I-210um (6oz) yesendlalelo sangaphakathi 210um (6oz) sendlalelo sangaphandle | |
| Min usayizi sokuprakthiza mechanical | 0.2mm (0.008 ″) | |
| Isilinganiso sesilinganiso | 12: 1 | |
| Usayizi wephaneli omkhulu | Ohlangothini Sigle noma izinhlangothi double: 500mm * 1200mm, | |
| Izingqimba Multilayer: 508mm X 610mm (20, X 24 ″) | ||
| Ububanzi bomugqa / isikhala | 0.076mm / 0.076mm (0.003 ″ / 0.003 ″) / 3mil / 3mil | |
| Nge-hole hole | Impumputhe / Ukungcwatshwa / Kuxhunyiwe (i-VOP, i-VIP…) | |
| I-HDI / iMicrovia | YEBO | |
| Surface sekugcineni | I-HASL | |
| Hola Mahhala HASL | ||
| Ukucwiliswa Igolide (ENIG), Ukucwiliswa Tin, Ukucwiliswa Isiliva | ||
| I-Organic Solderability Preservative (OSP) / ENTEK | ||
| I-Flash Gold (i-Hard Gold plating) | ||
| ENEPIG | ||
| Ukukhetha i-Gold Plating, ukujiya kwegolide kuze kufike ku-3um (120u ”) | ||
| Umunwe Wegolide, Ukuphrinta KweCarbon, Okucwebezelayo S / M. | ||
| Umbala wesifiva sesolder | Green, Blue, White, Mnyama, Sula, njll | |
| Impedance | Ukulandela okukodwa, umehluko, implanance ye-coplanar ilawulwa ± 10% | |
| Uhlaka lokuqeda uhlobo | CNC umzila; V-Ukushaya / Ukusika; Isibhakela | |
| Ukubekezelelana | Ukubekezelelana kweMin Hole (NPTH) ± 0.05mm | |
| Ukubekezelelana kweMin Hole (PTH) ± 0.075mm | ||
| Min Iphethini ukubekezelelana ± 0.05mm |
Ngesandla Esiqinile PCB (amakhono)
| Hlunga | Into | Amandla |  |
|
| Isendlalelo | Ngesandla Esiqinile-flex PCB | 2 ～ 14 | ||
| I-Flex PCB | 1 ～ 10 | |||
| Ibhodi | Ubuncane. Ubukhulu | 0.08 +/- 0.03mm | ||
| UMax. Ubukhulu | 6mm | |||
| UMax. Usayizi | 485mm * 1000mm | |||
| I-Hole & Slot | Ubuncane | 0.15mm | ||
| I-Min.Slot Hole | 0.6mm | |||
| Ukubukeka kwesilinganiselo | 10: 1 | |||
| Landelela | Ububanzi / Isikhala | 0.05 / 0.05mm | ||
| Ukubekezelelana | Landelela i-W / S | ± 0.03mm | ||
| (W / S≥0.3mm: ± 10%) | ||||
| Imbobo imbobo | ± 0.075mm | |||
| Ubukhulu beHole | ± 0.075mm | |||
| Impedance | 0 ≤ Inani ≤ 50Ω: ± 5Ω 50Ω ≤ Inani: ± 10% Ω | |||
| Izinto | Ukucaciswa kwe-Basefilm | PI: 3mil 2mil 1mil 0.8mil 0.5mil | ||
| I-ED &RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | ||||
| Umhlinzeki we-Basefilm Main | Shengyi / Taiflex / Dupont / Doosan / Thinflex | |||
| Imininingwane Yesembozo | PI: 2mil 1mil 0.5mil | |||
| Umbala we-LPI | Luhlaza / Ophuzi / Mhlophe / Mnyama / Luhlaza / Bomvu | |||
| I-PI Stiffener | T: 25um ～ 250um | |||
| I-FR4 Stiffener | T: 100um - 2000um | |||
| I-SUS Stiffener | T: 100um ～ 400um | |||
| AL Stiffener | T: 100um ～ 1600um | |||
| Tape | 3M / Tesa / Nitto | |||
| Ukuvikelwa kwe-EMI | Ifilimu lesiliva / i-Copper / inki yesiliva | |||
| Surface sekugcineni | I-OSP | 0.1 - 0.3um | ||
| I-HASL | Sn: 5um - 40um | |||
| I-HASL (Leed mahhala) | Sn: 5um - 40um | |||
| ENEPIG | UNi: 1.0 - 6.0um | |||
| Ba: 0.015-0.10um | ||||
| I-Au: 0.015 - 0.10um | ||||
| Ukuphahla igolide eliqinile | UNi: 1.0 - 6.0um | |||
| I-Au: 0.02um - 1um | ||||
| Flash igolide | UNi: 1.0 - 6.0um | |||
| I-Au: 0.02um - 0.1um | ||||
| ENIG | UNi: 1.0 - 6.0um | |||
| I-Au: 0.015um - 0.10um | ||||
| Ukucwiliswa isiliva | Isilinganiso: 0.1 - 0.3um | |||
| Plating Tin | Sn: 5um - 35um | |||