Uyemukelwa kuwebhusayithi yethu.

Multilayer PCB

  • 4 layer circuit board via plugged with solder mask

    4 ungqimba wesifunda ibhodi ixhunywe nge-solder mask

    Leli yibhodi lesifunda lesendlalelo eli-4 lomkhiqizo wezimoto. I-UL eqinisekisiwe i-Shengyi S1000H tg 150 FR4 impahla, i-1 OZ (35um) ukujiya kwethusi, i-ENIG Au Ubukhulu 0.05um; Ni Ubukhulu 3um. Ubuncane nge-0.203 mm ixhunywe ngemaski ye-solder.

  • 6 layer circuit board for industrial sensing & control

    Ibhodi lesifunda lesendlalelo eli-6 lokuzwa nokulawulwa kwezimboni

    Leli ibhodi lesifunda lesendlalelo eli-6 lomkhiqizo wokuzwa nokulawulwa kwezimboni. I-UL eqinisekisiwe uShengyi S1000-2 (TG T170 70) FR-4 impahla, 1 OZ (35um) ukujiya kwethusi, i-ENIG Au Ubukhulu 0.05um; Ni Ubukhulu 3um. V-amagoli, CNC Milling (umzila). Konke ukukhiqizwa kuhambisana nemfuneko ye-RoHS.

  • 8 layer circuit board OSP finish for embedded PC

    Isiphetho sebhodi yesifunda engu-8 se-OSP se-PC eshumekiwe

    Leli ibhodi lesifunda lesendlalelo eli-8 lomkhiqizo we-PC oshumekiwe. Isiphetho se-OSP (i-Organic Surface Preservative) siyinhlanganisela enobungani bemvelo, futhi siluhlaza ngokwedlulele uma siqhathaniswa nezinye iziqobelo ze-Lead-Free PCB, eziqukethe izinto ezinobuthi ezingaphezulu, noma ezidinga ukusetshenziswa kwamandla okuphezulu kakhulu. I-OSP iyindawo enhle yokuhola engenawo umkhondo, enezindawo ezicabalele ze-SMT Assembly, kepha futhi inempilo yeshalofu emfushane.

  • 10 layer circuit board for Ultra-rugged PDA

    Ibhodi lesifunda lesendlalelo eli-10 le-PDA ene-Ultra-rugged

    Leli ibhodi lesifunda lesendlalelo eli-10 lomkhiqizo we-Ultra-rugged PDA. Sisekela ikhasimende nge-PCB layout. Shengyi S1000-2 (TG≥170 ℃) FR-4 impahla. Ubuncane bomugqa ububanzi / isikhala se-4mil / 4mil. Via ixhunywe nge-solder mask.

  • 12 layer high tg FR4 PCB for Embedded System

    12 ungqimba high tg FR4 PCB yohlelo olushumekiwe

    Leli ibhodi lesifunda lesendlalelo eli-12 lomkhiqizo wesistimu oshumekiwe. Idizayini enolayini oqinile futhi kunesikhala esingu-0.1mm / 0.1mm (4mil / 4mil) kanye ne-Multi BGA. I-UL eqinisekisiwe ephezulu tg 170 impahla. Impedance engashadile nokuhlukaniswa okungafani.

  • 14 layer circuit board red solder mask

    Isendlalelo sebhodi lesifunda lesine elibomvu le-14

    Leli ibhodi lesifunda lesendlalelo eli-14 lomkhiqizo we-optronics. I-PCB enesiphetho segolide esinzima (umunwe wegolide). Njengoba kungumkhiqizo wobuchwepheshe obuphakeme, ukusetshenziswa kwempahla uShengyi S1000-2 FR-4 (TG≥170 ℃). I-solder iyifaka imbovu futhi ibonakale ikhanya.

  • 16 layer PCB Multi BGA for telecom

    16 ungqimba PCB Multi BGA ye-telecom

    Leli yibhodi lesifunda lesendlalelo eli-16 lomkhakha wezokuxhumana ngocingo. Usayizi weBhodi 250 * 162mm ne-PCB ukujiya okungu-2.0MM. IPandawill inikezela ngamabhodi wesifunda aphrintiwe ahlinzeka ngezinto ezahlukahlukene, izinsimbi zethusi, amazinga weDkt, nezindawo ezishisayo zemakethe yezingcingo eshintsha njalo.