| Ukucaciswa Kokufakwa Kwento | Ubuncane Precision | 0201 |  |
| Ukuphakama okuphezulu | 20mm | ||
| Isikhala esincane | I-BGA 0.4 Pitch | ||
| IC 0.3 Pitch | |||
| Ukucaciswa Kwebhodi | Ubukhulu obukhulu | 450 ╳ 730mm | |
| Ubukhulu beBhodi | 0.3 ~ 6mm | ||
| Uhlobo lweBhodi | Ngesandla Esiqinile Board, Flex IBhodi futhi Ngesandla Esiqinile-flex Board | ||
| Uhlobo lweSolder | I-HASL-free, i-HASL | ||
| SMT | I-POP, Bonding, i-Auto Plug-in | ||
| amandla wokukhiqiza | I-THT: 100,000 / ngenyanga | ||
| SMT: 2,000,000 / ngosuku | |||
| Ukuhlola Amandla | I-AOI, Ukuhlolwa kwe-X-ray, Ukuhlolwa kwe-ICT, Ukuhlola Ukundiza Kwe-Flying, Ukuhlolwa Komsebenzi, ukuhlolwa kokushiswa | ||
Uyemukelwa kuwebhusayithi yethu.