Ibhodi lokulawula ukucubungula kwesiginali
Imininingwane Yomkhiqizo
| Izinhla | Izingqimba eziyi-10 |
| Ukujiya kwebhodi | 1.60 MM |
| Izinto | I-Shengyi S1000-2 FR-4 (TG≥170 ℃) |
| Ubukhulu bethusi | I-1 OZ (35um) |
| Ukuqedelwa Kwaphezulu | Ukucwiliswa Igolide; I-Au Ubukhulu 0.05 um; Ni Ubukhulu 3um |
| I-Min Hole (mm) | 0.1mm ixhunywe nge-epoxy |
| Min Line Ububanzi (mm) | 0.12mm |
| I-Min Line Space (mm) | 0.15mm |
| Isifihla Solder | Okuluhlaza okotshani |
| Umbala Wezinganekwane | Mhlophe |
| Usayizi webhodi | 160 * 150 |
| PCB LoMhlangano | Indawo ehlanganisiwe ukukhweza & ngomhlangano womgodi |
| I-RoHS Iyahambisana | Hola inqubo yenhlangano yamahhala |
| Min izingxenye usayizi | 0402 |
| Izingxenye eziphelele | 1205 ibhodi ngalinye |
| Iphakheji le-IC | BGA; QFN |
| IC eyinhloko | UMaxim, Freescale Semiconductor, CYPRESS, ALTERA, ISSI, COSEL, CORTINA |
| Isivivinyo | I-AOI, i-X-Ray, ukuhlolwa okusebenzayo |
| Isicelo | Ukucutshungulwa kwesiginali yezimboni |
Izicelo zezimboni ziqukethe ubuchwepheshe obuhlukahlukene obusetshenziswa ezimbonini eziningi. Kusuka kumhlangano webhodi lesifunda (PCBA) ophrintiwe kuya emhlanganweni ophelele womkhiqizo nokukhiqiza, kusho ukubhekana namabhodi wesekethe kagesi anzima kanye nokuvalelwa kwemishini (izinsimbi zeshidi, i-CNC, amapulasitiki), ukufinyelela umphumela omuhle kumakhasimende ethu. Umlingani wakho we-EMS kumele abe ngungoti iminyaka yezixazululo zokukhiqiza ngogesi.
Imboni yezimboni ngokomlando ibiyingxenye eyodwa enkulu ebisetshenziswa yiPandawill kepha manje sesibona i-Intanethi Yezinto, ngokugxila ngqo kwi-Industrial Internet of Things (IIoT), ezoletha ukuxhumeka nokuzenzekelayo emafektri nasezinkampanini ezizungeze umhlaba.
Ukusekela intuthuko enjalo, ukuhlangana nomlingani ofanele kuyasiza ekuletheni imikhiqizo emisha emakethe ngempumelelo. EPandawill, sinikela ngezinsiza ezigcwele ezivela ekwakhiweni nasekucacisweni kwencazelo ekukhiqizweni ngobuningi kuzo zonke izindawo zethu eziyi-18.
Njengenkampani yokukhiqiza inkontileka kagesi kanye nomenzi wezezimboni wezimboni, umholi emikhakheni yethu, sihlanganise emafektri ethu izindlela ezintsha ezilethwe nemboni engu-4.0, njenge: ezishintshayo, ubuhlakani bokufakelwa, i-computing yamafu, i-3D-Printing, i-Internet of Things platforms (IoT ), idatha enkulu nezibalo.
Umhlinzeki wesevisi yokukhiqiza elekthronikhi yezimboni, amakhono ethu afaka:
> I-ATM nemishini yezimboni
> Amadivayisi we-Automation nemishini
> Imishini
> Imishini yokukhipha
> Izinhlelo zamandla
> Ukuhanjiswa kukagesi
> Abamukeli, Abathumeli
> Amathuluzi wamandla
> Amadivayisi we-Instrumentation nemishini
